CXMT to Supply New Memory Chips for Xiaomi’s Foldable Smartphone
Chinese chipmaker ChangXin Memory Technologies (CXMT) is preparing to provide its latest LPDDR6 DRAM chips for Xiaomi’s upcoming foldable smartphone, set to be a flagship device. This announcement was made on Weibo, where CXMT proudly stated that it has started mass-producing these next-generation memory chips specifically for Xiaomi’s new model, the 18 Fold.
The production of the LPDDR6 memory comes less than a year after CXMT began making the previous version, LPDDR5. Xiaomi, one of the biggest smartphone manufacturers globally, has confirmed the partnership and revealed that the 18 Fold is expected to hit the market in September.
The LPDDR6 chip represents a significant step forward for CXMT, as it moves closer to competing with well-established companies like SK Hynix and Samsung in the semiconductor field. Xiaomi mentioned that the 18 Fold will likely feature an upgraded version of its custom-designed 3nm mobile processor called the Xring O3, which is built to support the new LPDDR6 memory architecture.
Based in Hefei, CXMT has already shared initial evaluation samples of the LPDDR6 chips with clients for use in smartphones, enterprise servers, and smart vehicles.
Earlier this year, there were reports indicating that Apple had sought approval from the Trump administration to purchase memory chips from CXMT. This Chinese company is under scrutiny by the Pentagon due to alleged ties with the People’s Liberation Army. While Apple is not officially prohibited from acquiring chips from CXMT or YMTC (another Chinese memory chip maker), both firms have been listed on the Pentagon’s military company blacklist. Recently, CXMT has also gained recognition as one of China’s most valuable companies.
