Chinese Chip Maker Launches New Technology to Compete Globally
Beijing, September 20 — Chinese DRAM chip manufacturer CXMT has announced the start of mass production for its fifth-generation technology platform. This development is seen as a significant step that could help China establish a stronger presence against major players like Samsung Electronics, SK Hynix, and Micron Technology in the global memory chip market.
Dynamic Random-Access Memory (DRAM) is a key component used in smartphones, computers, and various devices to run applications and programs. CXMT’s new platform aims to produce more efficient and powerful memory chips at a lower cost while consuming less energy. The company, which recently made its debut on Shanghai’s STAR Market, believes this will provide additional chip supply options for electronic manufacturers.
The Hefei-based manufacturer highlighted that its latest technology allows data storage features to be packed closer together, enabling more memory to fit on each chip and producing more chips from a single silicon wafer. Notably, they have achieved a data storage feature spacing of just 11.95 nanometers, which is equivalent to 12 billionths of a meter.
To accomplish this, CXMT utilized a method called “quadruple patterning,” which involves multiple manufacturing steps to create finer circuit patterns. According to Luo Xiaodong, the vice president and marketing leader of CXMT, their new process capabilities are now competitive with the leading production techniques in the industry.
In addition to this, CXMT introduced two new 24-gigabit LPDDR5X chip products made on the new platform. LPDDR5X memory is known for its energy efficiency and is primarily used in smartphones and other portable devices. These new products offer a 50% increase in data capacity compared to the previous versions and are already in mass production, available in two different package designs for various devices.
CXMT claims that their new platform can produce at least 50% more usable chips per wafer than previous generations, using an 8-gigabit chip as the baseline measurement — this refers to the number of chips that can potentially be made before accounting for defective units.
The company developed this innovative platform through computer simulations and collaboration with domestic chip equipment manufacturers on key production processes. This breakthrough comes at a time when the Chinese government is focused on decreasing reliance on foreign semiconductor technologies, particularly as U.S. export controls have limited access to advanced chipmaking equipment and software since 2022.
This initiative marks an essential stride for China in its quest for technological independence and strengthens its competitive edge in the semiconductor industry.
