Murata Manufacturing Co., Ltd. has teamed up with Synopsys, Inc. to make it easier for users of Synopsys’ simulation tools to access Murata’s latest high-performance simulation models. This partnership focuses on Synopsys’ 3D electromagnetic field analysis tool, Ansys HFSS, and the thermal analysis tool, Ansys Icepak. This collaboration represents a major advancement in simplifying the simulation process for electronic circuit designers. Notably, Murata is the first company to provide passive component simulation models through Ansys Icepak.
As the need for high-speed and high-capacity communications grows, the complexity of electronic circuit design is also increasing. Engineers must consider various factors like electromagnetic interference (EMI) and heat generation from components within a single design. Tackling these issues early on is vital; failing to do so can lead to expensive redesigns, extended development times, and increased prototyping costs. This scenario has pushed electronic component suppliers to deliver ready-to-use, high-quality simulation models that work seamlessly with existing engineering tools.
Creating precise models for electromagnetic and thermal analysis is challenging, as both electromagnetic behavior and temperature can vary widely based on design conditions. Murata’s comprehensive approach, which includes everything from raw material development to final product processing, allows the company to use a wealth of proprietary data. This results in simulation models that accurately represent real-life component performance.
The simulation models are compatible with Ansys 2026 R1, with Ansys HFSS focusing on electromagnetic field analysis for Murata’s RF inductors and multilayer ceramic capacitors (MLCCs). Meanwhile, Ansys Icepak is used for thermal analysis, particularly for Murata’s power inductors.
Looking forward, Murata plans to enhance its partnership with Synopsys and expand its range of simulation models to support even more advanced electronic design needs.
